Custom HDI PCB for Achieving Ultra-Miniaturized Devices:
The High Density Interconnect Board (HDI Board) is an advanced printed circuit board designed to meet the growing demands of modern electronic devices. This High Density Interconnection Board offers exceptional performance, reliability, and compactness, making it an ideal choice for applications requiring high circuit density and superior electrical integrity. Manufactured using high-quality FR4 material, the board ensures excellent mechanical strength and thermal stability, catering to a wide range of industrial and commercial uses.
HDI PCB’s Core Application Devices:
- 5G-enabled mobile phones & portable tablets
- IoT gadgets (wearable tech, intelligent sensors)
- Medical instruments (diagnostic equipment, implantable devices)
- Automotive tech (ADAS systems, in-car entertainment)
- Aerospace & defense gear (satellite parts, radar systems)
- High-performance computing (data center servers, graphics cards)
- Consumer electronics (VR/AR devices, civilian drones)
HDI PCB Main Manufacturing Process::
1. Design & Core Prep: Circuit design finalized. Thin, copper-clad cores prepared for inner layers.
2. Laser Drilling & Metallization: Key HDI Step: Precise lasers create microvias (tiny holes <150µm). Holes/vias are plated with copper to make electrical connections.
3. Layer Imaging & Lamination: Circuit patterns transferred onto layers (photolithography/etching). Multiple layers aligned, stacked with insulating material (prepreg), and laminated under heat/pressure.
4. Surface Finish & Testing: Final outer circuits etched. Protective/solderable surface finish (e.g., ENIG, HASL) applied. Rigorous electrical and optical testing performed.
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